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Cluster Report Photonics in the Capital Region Berlin-Brandenburg

  • Text
  • Imaging
  • Photonics
  • Berlin
  • Optical
  • Laser
  • Technologies
  • Optics
  • Microsystems
  • Components
  • Brandenburg

92

92 Cluster Report Optics and Photonics – Microelectronics and Microsystems Technology The industries in which Berlin Brandenburg are particularly strong are following this trend and are increasingly integrating electronics and microsystems into their products. These industries include control and regulation technology, mechanical and plant engineering, energy technology, medical technology, aerospace technology, and logistics. This is where companies in the region can play a major role. They enjoy strong ties to research and development, have an excellent knowledge base, are very flexible, and are well networked with each other as well as with institutions active in system integration research. Image 1 Fully automatic UBM and balling of wafers Figure 2 High-precision placement of optoelectronic components © AEMtec GmbH AEMtec GmbH is a medium-sized company with a broad technology portfolio (wafer back-end, flip chip, chip on board, SMT, box build) to produce microelectronic and optoelectronic modules with high-precision positioning accuracy in the submicrometre range and 30 years’ experience in integrated circuit packaging. In addition to design and development, its services include prototyping (NPI), qualification, production, testing, as well as supply chain management along the entire product lifecycle. www.aemtec.com/en/ In addition to physical integration into the application environment, which is not always easy, these technologies must also ensure that the structures are miniaturised, robust, and durable, because the deep integration of electronics and microsystems technology makes this indispensable while complicating repairs. The traditional ways component and assembly manufacturers and suppliers of electronic systems have cooperated are not transferable to the creation of such integrated solutions. Instead, those who want to incorporate electronic components into their products need to include them from the outset. New approaches are also needed in research and the development of new products. Berlin Brandenburg is well prepared for this development because the companies here are focusing on technically sophisticated products and integrated services. The trend towards increasingly integrated electronics fits well with the automotive industry, for example, where 90% of all innovations are associated with the use of electronics and microsystems technology. Finetech offers manual, semi-automated and automatic bonding systems for optoelectronics and microelectronics. © Finetech GmbH & Co KG

Cluster Report Optics and Photonics – Microelectronics and Microsystems Technology 93 The wireless sensors below the insulators enable the monitoring of high and extra-high voltage lines. © Fraunhofer IZM Pac Tech – Packaging Technologies GmbH is another high-tech supplier with roots in Berlin Brandenburg. The company develops and sells machines for applying semiconductors to printed circuit boards. It offers both the machines and the services: it can place electrical contacts on microchips. Major providers such as Intel and Samsung are among its customers. The company was founded in 1995 as a spin-off from Fraunhofer IZM. Since then it has been a real success story: it opened its first manufacturing plant in Nauen, Brandenburg, in 1997. It added a second in California in 2001 and a third in Malaysia seven years later. By 2015, the company had already shipped its 1,000th system. The Japanese NAGASE Group also took over the company in full that year. The product range includes generators and transducers for ultrasonic wire and dye bonding. Special measuring and test equipment were developed so that the ultrasonic systems in the bonding machines can be optimally set up and monitored. This includes a transducer test system and optical vibration amplitude measurement technology (laser vibrometer). This equipment is suitable both for service on the bond machinery and for quality assurance. This makes it possible to document the condition of the ultrasound system within the framework of quality management systems. The use of the measuring equipment also makes preventive maintenance and servicing of the ultrasonic systems of the bonding machines possible for the first time. www.fkphysiktechnik.com/index_e.htm www.pactech.com F&K Physiktechnik GmbH in Potsdam develops and manufactures assemblies and processes that are used for chip contacting in microelectronics manufacturing worldwide. The focus of F&K Physiktechnik is on assembly and connection technology for microsystems technology. Finetech GmbH & Co KG is a special machine construction company and offers customised equipment solutions for high-precision assembly applications in optoelectronics and microelectronics. Manual, semi-automated, and automatic bonding systems are available and offer maximum process flexibility due to their modular design. The products support a wide range of modern joining technologies, including ultrasonic bonding, thermocompression bonding,

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