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Cluster Report Photonics in the Capital Region Berlin-Brandenburg

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  • Imaging
  • Photonics
  • Berlin
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  • Optics
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  • Brandenburg

5.2.4 System Integration

5.2.4 System Integration Technology Increasingly compact, powerful and user-oriented – system integration makes the difference Harald Pötter, Klaus-Dieter Lang, Martin Schneider-Ramelow, Oswin Ehrmann, Karl-Friedrich Becker, Maik Hampicke, Gerrit Rössler, Kai Kolwitz The previous sections demonstrate impressively that electronics and microsystems technology have become integral parts of everyday life. In the future, however, not only the components will be important but also the integration of technologies. More and more, electronics and microsystems technology are merging in material and shape with the actual product: independent, subsequently assembled components will be replaced by fully integrated solutions, customized to the application system. Pivotal are appropriate integration technologies. Aside from the not always easy physical integration into the application environment, these technologies also must ensure that the structures are miniaturized, robust and durable - because the deep integration of electronics and microsystems technology makes this essential and repairs complex. Virtually invisible, but indispensable: application adapted multifunctional electronics © Fraunhofer IZM The classical interaction of component manufacturers, module producers and providers of electronic systems does not lend itself to the creation of such integrated solutions. Instead, those who want to integrate electronic components into their products must be involved from the start. Also in research and development of new products new approaches are needed. Berlin-Brandenburg is well prepared for the development. Regional companies are focusing on technically challenging products and integrated services. The trend towards ever more integrated electronics fits into the picture as well, such as in the automotive industry, where 90% of all innovations are connected to the use of electronics and microsystems. It is precisely the industries in which Berlin is strong which follow this trend and increasingly integrate electronics and microsystems into their products: management and control engineering, mechanical engineering, energy technology, medical technology, aviation and aerospace, and logistics. Here, Berlin-Brandenburg companies play to their strengths: strong relations to research and development, excellent knowledge base, flexibility and strong networking, both among themselves and with the scientific institutions that are active in system integration. More and more and smaller and smaller Well-known research institutes such as the Technical University of Berlin and the Fraunhofer-Institute for Reliability and Micro Integration (IZM) in Berlin are ready to develop and test new technologies together with companies. Both closely cooperate. At the TU is, among others, the Department of Microelectronics, Packaging and Interconnection Technologies at the Faculty of Electrical Engineering, and there is also the research focus "Microperipheric Technologies". Together with the Fraunhofer IZM, one is searching for new concepts for smaller and more highly integrated systems, is looking for new design methodologies for such circuits, researches on vertical 3D integration techniques and further develops the concept of e-grains, autonomous miniaturized sensor systems for wireless networking solutions, including in agriculture and food technology. Both institutions also operate the Berlin Center of Advanced Pakkaging where system integration is done together with system and component manufacturers. The Technical University concentrates more on basic research while the IZM is predominantly responsible for the practical implementation. This is a natural division, as the Fraunhofer-Institute not only pursues own ideas in terms of system integration, but also - together with partners from academia and industry – successfully translates research approaches into prototypes and production concepts since many years. Assemblies on wafer-level Integrated systems often have overall dimensions of just a few millimeters. They consist of components which are only a few hundred micrometers in size. In order to realize wiring structures, contacts or functional layers, it is necessary to control processes in the nanometer range and to fundamentally understand physical effects such as material properties, heat dissipation and the like. This is particularly evident when you look at integration technology based at the wafer-level. They are already used in a variety of products. In this technology, all process steps follow the actual semiconductor processes and are performed at wafer level. Using thin-film processes components can be integrated, and via bumping procedures standard assembly processes are possible. 94

5.2.4 System Integration Technology The Fraunhofer IZM is heavily involved in the field of wafer-level packaging. They are currently working hard on processes to build systems on an IC and on wafer-level molding concepts. In the future, functional layers will play a larger role, where for example, strongly thinned components are integrated by means of honeycomb structures into cavities, polymer layers or capacitors. Among the companies developing wafer-level components, for example, is the Berlin MSG Lithoglas, which cooperates closely with the IZM. Lithoglas offers as pre-packaging solution at wafer level bonded glass covers with enclosed cavity for early protection of sensitive structures. have competency in system integration. AEMtec, for example, is not only skilled at flip-chip and chip-on-board, but also in development and production of opto-electronic modules with highest positioning accuracy in the sub-micron range via fully automated processes. Syscom offers service in the manufacture of innovative electronic products, from prototype to production. Swissbit with its production plant in Berlin is one of the leading engineering and manufacturing companies of memory components on DRAM and flash basis which are used in embedded PCs. Spree Hybrid is a system provider for the manufacture of electronic components. They manufacture electronic components in SMD and conventional technology, as well as thick-film hybrid technology for medium and large lots. In addition, they support the design of prototypes. alpha board has specialized in development and system design: they design circuits and circuit board layouts, select components, and simulate and organize production. They assign great importance to the “leading edge”; among their references are Siemens, Fiat and the German Center for Aerospace. At wafer-level bonded glass caps with enclosed cavity on 150 mm substrate © MSG Lithoglas AG A Fraunhofer spin-off is Pac Tech in Nauen, which is not only the world leader in terms of wafer-level packaging and bumping, but also offers the necessary technology for the packaging. Atotech, a Berlin-based company and subsidiary of the Total Group, is one of the world-wide leading companies in plants and process chemistry for wafer-level packaging and printed circuit board manufacture. PCBs must be more than just back plates In terms of system integration, PCBs need to acquire new capabilities: the vast majority of currently available electronic systems are based at the core on a substrate on which individual components are placed. So far, the substrate is only used for providing electrical connections and as mechanical support. But that must and will change: technologies for embedding electronic components into organic composite materials or in encapsulating materials like molding compounds allow systems smaller than ever before and at the same time very reliable. Based on this principle, for example, medical implants are already produced. Layout section from alpha board © alpha board GmbH System integration challenge Electronics fully integrated into the receiving system: required are advanced functionality, extreme miniaturization and ruggedness, durability and low production costs. The classical system boundaries in research and development are dissolving. In the future, technology development will begin with product design and material development and end with product qualification and life prediction. Berlin-Brandenburg is well prepared because cooperation across traditional departmental boundaries is essential to the philosophy of the capital research and economic region. Contact: Harald Pötter Fraunhofer IZM Phone: 030 / 46403 742 Email: harald.poetter@izm.fraunhofer.de Among the Berlin based companies versed in the manufacture of PCBs is Heidenhain Microprint, where they have mastered use of a plethora of special technologies and materials. Contag and Andus Electronic, both also from Berlin, have focused on the rapid production of prototypes – including consulting and support in the development of layouts. And, of course, all companies in Berlin and Brandenburg with expertise in the development and manufacturing of microsystems 95

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