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Cluster Report Photonics in the Capital Region Berlin-Brandenburg

  • Text
  • Imaging
  • Photonics
  • Berlin
  • Optical
  • Laser
  • Technologies
  • Optics
  • Microsystems
  • Components
  • Brandenburg

82

82 Cluster Report Optics and Photonics – Microsystems Technology The traditional ways component and assembly manufacturers and suppliers of electronic systems have cooperated are not transferable to the creation of such integrated solutions. Instead, those who want to incorporate electronic components into their products need to include them from the outset. New approaches are also needed in research and the development of new products. Berlin Brandenburg is well prepared for this development because the companies here are focusing on technically sophisticated products and integrated services. The trend towards increasingly integrated electronics fits well with the automotive industry, for example, where 90% of all innovations are associated with the use of electronics and microsystems technology. The industries in which Berlin Brandenburg are particularly strong are following this trend and are increasingly integrating electronics and microsystems into their products. These industries include control and regulation technology, mechanical and plant engineering, energy technology, medical technology, aerospace technology, and logistics. This is where companies in the region can play a major role. They enjoy strong ties to research and development, have an excellent knowledge base, are very flexible, and are well networked with each other as well as with institutions active in system integration research. AEMtec GmbH is a medium-sized company with a broad technology portfolio (wafer back-end, flip chip, chip on board, SMT, box build) to produce microelectronic and optoelectronic modules with high-precision positioning accuracy in the submicrometre range and 30 years’ experience in integrated circuit packaging. In addition to design and development, its services include prototyping (NPI), qualification, production, testing, as well as supply chain management along the entire product lifecycle. Image 1 Fully automatic UBM and balling of wafers Figure 2 High-precision placement of optoelectronic components © AEMtec GmbH The company was founded in 1995 as a spin-off from Fraunhofer IZM. Since then it has been a real success story: it opened its first manufacturing plant in Nauen, Brandenburg, in 1997. It added a second in California in 2001 and a third in Malaysia seven years later. By 2015, the company had already shipped its 1,000th system. The Japanese NAGASE Group also took over the company in full that year. www.aemtec.com/en/ www.pactech.com Pac Tech – Packaging Technologies GmbH is another high-tech supplier with roots in Berlin Brandenburg. The company develops and sells machines for applying semiconductors to printed circuit boards. It offers both the machines and the services: it can place electrical contacts on microchips. Major providers such as Intel and Samsung are among its customers. F&K Physiktechnik GmbH in Potsdam develops and manufactures assemblies and processes that are used for chip contacting in microelectronics manufacturing worldwide. The focus of F&K Physiktechnik is on assembly and connection technology for microsystems technology. The product range includes generators and transducers for ultrasonic wire and dye bonding. Special measuring

Cluster Report Optics and Photonics – Microsystems Technology 83 and test equipment were developed so that the ultrasonic systems in the bonding machines can be optimally set up and monitored. This includes a transducer test system and optical vibration amplitude measurement technology (laser vibrometer). This equipment is suitable both for service on the bond machinery and for quality assurance. This makes it possible to document the condition of the ultrasound system within the framework of quality management systems. The use of the measuring equipment also makes preventive maintenance and servicing of the ultrasonic systems of the bonding machines possible for the first time. www.fkphysiktechnik.com/index_e.htm Finetech GmbH & Co KG is a special machine construction company and offers customised equipment solutions for high-precision assembly applications in optoelectronics and microelectronics. Manual, semi-automated, and automatic bonding systems are available and offer maximum process flexibility due to their modular design. The products support a wide range of modern joining technologies, including ultrasonic bonding, thermocompression bonding, bonding technologies, laser soldering, and soldering in different environments. Typical applications are the assembly of laser and photodiodes, laser bars, sensors, VCSEL, and MOEMS. The applications range from basic research and development of innovative semiconductor products to fully automated production environments with high throughput. www.finetech.de ESYS GmbH develops and manufactures low-energy minaturized electronics with a focus on mobile applications. Since 1992, the Berlin-based company has been successfully implementing its own standard products as well as customer-specific hardware and software developments. These include in particular battery-powered long-term miniature data loggers for temperature, humidity, motion, acceleration, shock, and position. They are used, for example, for the remote location and fleet management of vehicles, machines, and containers. www.esys.eu/home.html Applications for Sensors New sensors for agriculture The quality of the silage-making process is decisive for the efficient production of biogas. Until now, there has been no suitable sensor system that could monitor the silage process from the opening of the silo to the removal of the silage. With the multisensor technology developed by Fraunhofer IZM, the Julius Kühn Institute in Braunschweig, and ESYS GmbH, it is now possible for the first time to monitor compaction at critical points such as edge areas during start-up and simultaneously record the pH value. Likewise, disturbance variables during the ensiling process and after removal are detected at an early stage and can be eliminated before a reduction in silage quality occurs. The use of a common software standard in harvest data management also ensures that the sensor data can later be integrated into already established software solutions and thus transferred directly into practice. Finetech offers manual, semi-automated and automatic bonding systems for optoelectronics and microelectronics. © Finetech GmbH & Co KG Sensor network for high voltage lines The autonomous sensor network ASTROSE monitors operation-relevant parameters of high-voltage overhead lines in order to make optimum use of their transmission capacities. Field trials have shown that capacity reserves can be raised by as much as 20% in this way. For this system developed jointly with colleagues from Fraunhofer ENAS and First Sensor Microelectronic Packaging, software tools are

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