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Cluster Report Photonics in the Capital Region Berlin-Brandenburg

  • Text
  • Imaging
  • Photonics
  • Berlin
  • Optical
  • Laser
  • Technologies
  • Optics
  • Microsystems
  • Components
  • Brandenburg

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40 Cluster Report Optics and PhotonicsPhotonics for Communications and Sensors are used in data centres and also for sensory integration platforms. www.izm.fraunhofer.de/en.html Polyboard 1x1 structure with lilix ® reflector © FOC – fibre optical components GmbH Photonic System Integration Turns Components into Complex Systems Optical data transmission and sensor technology are more than just transmitters and receivers. In addition to electronic components, light sources (edge-emitting lasers, VCSEL, or LEDs), and detectors, but also passive elements such as lenses, optical fibres, filters, and polarisers are integrated into optoelectronic and photonic modules with transmitters and receivers, modulators, amplifiers, and switches. Such modules are much more complex than purely electronic modules and are therefore still usually set up and adjusted manually. Energy consumption and high data rates are some of the biggest challenges that come with the steady growth of data traffic. Berlin-based Sicoya GmbH is offering a solution in the form of low-cost, energy-efficient, and scalable optical transceiver chips. The technology company has won numerous prizes, including the “Berlin-Brandenburg Innovation Award”, the “Start-up Energy Transition Award”, and the “Deep Tech Award”. The company, which was spun off from TU Berlin in 2015, can look back at ten years of successful research and development work in the field of silicon photonics. This disruptive technology is making it possible for the next generation of data centres to have optical connections that will excel not only through less energy consumption, but also through lower costs and high scalability. Sicoya’s special solution lies in the co-integration of ultra-fast electronic Bi-CMOS circuits for drivers and amplifiers with photonic elements on the same chip. This integration leap directly translates into higher energy efficiency for the electronics and the use of light from the laser source, resulting in outstanding performance in terms of energy consumption, reliability, and signal integrity. The chips are distributed worldwide as OEM products or packaged with optical interfaces as transceiver modules. One example of this is the manufacture of very high-quality micro-resonators from optical glass fibres. There is currently some very promising work underway in this field at the Fraunhofer Institute for Reliability and Microintegration IZM, which, in addition to production, also focuses on the packaging of these highly sensitive components. Many activities at Fraunhofer IZM (such as the PhoxLab) are described in detail in chapter 2.6 “Microsystems Technology” of this Report. Last year, the start-up was able to acquire Series B financing from various well-known international investors. These resources have made the ramp-up to producing several thousand transceiver modules each month possible, thus realising Sicoya’s vision of faster and more energy-efficient data transfers. www.sicoya.com Fraunhofer IZM develops standardised methods and processes for assembly and connection technology that are suitable for automation and drastically reduce manufacturing costs. For example, electro-optical interposers and printed circuit boards are based on display glass into which optical waveguides have been embedded. These Numerous companies in industry are also involved in integrated microoptics. The AEMtec GmbH in Berlin-Adlershof, for example, specialises in the development, qualification, industrialisation, and production of microelectronic and optoelectronic modules and complete systems. Using high-end technologies such as UBM, solder balling, stud

Cluster Report Optics and PhotonicsPhotonics for Communications and Sensors 41 Highly complex assembly of micro-mirrors © AEMtec GmbH Optical transceiver based on a 2.5D glass interposer with optoelectronic components and microlenses © Fraunhofer IZM bumping, chip on board, flip chip, and opto-packaging, highly complex electronic assemblies (optical assemblies, micro-optics, imaging arrays, VCSEL assemblies, sensor systems, optical MEMs, hybrid electronic assemblies) are manufactured with micrometre-accuracy precision. www.aemtec.com/en H-field of a curved waveguide, calculated with VPImodeDesigner © VPIphotonics GmbH Optical transceiver module for data centre connections © Sicoya GmbH A champion in the field of simulation and calculation of optoelectronic systems is VPIphotonics GmbH, headquartered in Berlin. It offers professional simulation software for the design of active and passive components, fibre-optic applications, optical communication systems, and cost-optimised network planning. In addition, its team of experts consults, addresses customer-specific design and configuration requirements, and provides training on appropriate modelling techniques and advanced software features. From the theoretical model of an opto-semiconductor made by a solid state physicist to engineering support for production, and from optical chips to assembly and connection technology to complete optical systems, Berlin Brandenburg offer the entire spectrum of optical data transmission and sensor technology. A viable network has been created in the region that can meet almost all the challenges for finding a solution. Contact: Dr.-Ing. Henning Schröder Spokesperson Focus Area Photonics for Communications and Sensors Phone: +49 (0)30 46403-277 E-mail: henning.schroeder@izm.fraunhofer.de www.vpiphotonics.com

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